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脚位/封装 | FBGA-96 |
外包装 | TRAY |
无铅/环保 | 无铅/环保 |
电压(伏) | 1.5 V |
温度规格 | 0°C~+95°C |
速度 | 1866 MHz |
标准包装数量 | 1600 |
标准外箱 | |
Number Of Words | 256M |
Bit Organization | x16 |
Density | 4G |
Operating Temperature | commercial temperature(0°C~85°C) & normal power |
Package Material | lead & halogen free(ROHS compliant) |
Hynix Memory | H |
Die Generation | 4th |
No Of Banks | 8 banks |
Product Family | DRAM |
Shipping Method | tray |